Molex 1040310811 | MICROSD CARD (PUSH-PULL)

Product Weight (g)

0.259

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8538.90.81.80

Automotive

No

PPAP

No

Terminal Pitch (mm)

1.1

Termination Method

Solder

Body Orientation

Right Angle

Maximum Current Rating (A)

0.5/Contact

Maximum Voltage Rating

10VDC|10VAC

Insulation Resistance (MOhm)

1000

Maximum Contact Resistance (mOhm)

100

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Maximum Insertion Force

15N

Mating Cycle (Cycles)

10000

PCB Mounting Side

Normal

Product Depth (mm)

11.4

Tradename

microSD Card

Mounting

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Micro SD Card

Number of Rows

1

Gender

SKT

Number of Contacts

8

Terminal Plating

Gold Over Nickel

Product Length (mm)

11.14

Product Height (mm)

1.42